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Flat pack interconnection structure simplifies modular electronic assembliesFlat pack interconnection structure composed of stick modules simplifies modular electronic assemblies by allowing a single axis mother board. Two of the wiring planes are located in the stick module, which is the lower level of assembly, with the third wiring plane in the mother board.
Document ID
19670000559
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Katzin, L.
Date Acquired
August 3, 2013
Publication Date
December 1, 1967
Subject Category
Electronic Components And Circuits
Report/Patent Number
JPL-819
Report Number: JPL-819
Accession Number
67B10560
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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