Isolation of components on a silicon wafer using SiO2

Isolation of components on silicon wafer by groove etching and silicon dioxide deposition

Document ID

19670000915

Acquisition Source

Legacy CDMS

Document Type

Contractor Report (CR)

Authors

Date Acquired

August 3, 2013

Publication Date

November 1, 1966

Subject Category

Report/Patent Number

Accession Number

67N10238

Funding Number(s)

Distribution Limits

Public

Work of the US Gov. Public Use Permitted.

Keywords

Name

Type

STI

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