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Nondestructive testing techniques for multilayer printed wiring boardsAxial transverse laminography and mutual coupling nondestructive techniques for inspection of multilayer printed circuit boards
Document ID
19670014339
Acquisition Source
Legacy CDMS
Document Type
Other
Authors
Blanche, J. F.
Date Acquired
August 3, 2013
Publication Date
January 1, 1967
Subject Category
Electronic Equipment
Accession Number
67N23668
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
CIRCUIT BOARD
OPTICAL COUPLING
MULTILAYER STRUCTURE
NONDESTRUCTIVE TESTING
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