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Microelectronic packagingHybrid assembly processes for packaging of thin film and semiconductor microelectronic devices
Document ID
19670024034
Acquisition Source
Legacy CDMS
Document Type
Other
Authors
Noyes, C. F.
Date Acquired
August 3, 2013
Publication Date
March 1, 1967
Subject Category
Electronic Equipment
Accession Number
67N33363
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Keywords
THIN FILM
MICROELECTRONICS
SEMICONDUCTOR DEVICE
PACKAGING
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IDRelationTitle19670024032Collected WorksResearch and development programs Quarterly report, Jan. - Mar. 196719670024032Collected WorksResearch and development programs Quarterly report, Jan. - Mar. 1967N67-33361 19-34Collected Works
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