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Reliability through packaging design.Relation between packaging design and cooling, vibration, RF interference and reliability of microelectronic systems used in space vehicles
Document ID
19670038738
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Kuehn, R. E.
Price, F. J.
Date Acquired
August 3, 2013
Publication Date
January 1, 1966
Subject Category
Electronic Equipment
Accession Number
67A17467
Funding Number(s)
CONTRACT_GRANT: NAS8-11562
CONTRACT_GRANT: NAS8-11561
Distribution Limits
Public
Copyright
Other
Keywords
COOLING SYSTEM
ELECTRONIC PACKAGING
SYSTEM FAILURE
SPACECRAFT ELECTRONIC EQUIPMENT
RELIABILITY

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