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A three dimensional photoelasto-plastic stress analysis method.Photoelastoplastic method using creep and stress characteristics of epoxy resins under thermal cycle, discussing stress-strain behavior
Document ID
19670055157
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Hunter, A. R., Jr.
Date Acquired
August 3, 2013
Publication Date
May 1, 1967
Subject Category
Structural Mechanics
Report/Patent Number
SESA PAPER 1191
Report Number: SESA PAPER 1191
Accession Number
67A33886
Funding Number(s)
CONTRACT_GRANT: NAS1-4760
Distribution Limits
Public
Copyright
Other
Keywords
ELASTIC PROPERTY
EPOXY RESIN
CREEP ANALYSIS
STRESS-STRAIN DISTRIBUTION

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