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Standards for compatibility of printed circuit and component lead materialsStudy of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material specifications.
Document ID
19680000310
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Date Acquired
August 4, 2013
Publication Date
August 1, 1968
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-14531
Report Number: MFS-14531
Accession Number
68B10310
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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