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Bonding large area silicon wafersLow temperature liquid-solid and solid-solid diffusion bonding of silicon substrates to heat sinks
Document ID
19680015629
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Date Acquired
August 4, 2013
Publication Date
January 1, 1968
Subject Category
Machine Elements And Processes
Report/Patent Number
QR-3
NASA-CR-94769
Report Number: QR-3
Report Number: NASA-CR-94769
Accession Number
68N25101
Funding Number(s)
CONTRACT_GRANT: JPL-952022
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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