Failure analysis using a scanning electron microscope.Component failure modes analysis using scanning electron microscopy, noting applications to study of semiconductors and wire plating anomalies
Document ID
19680046272
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Anstead, R. J.
Date Acquired
August 4, 2013
Publication Date
January 1, 1968
Publication Information
Publisher: INST. OF ELECTRICAL AND ELECTRONICS ENGINEERS, INC.,
Subject Category
Electronic Equipment
Meeting Information
Meeting: ANNUAL RELIABILITY PHYSICS SYMPOSIUM
Location: LOS ANGELES, CA
Start Date: November 6, 1967
End Date: November 8, 1967
Sponsors: INST. OF ELECTRICAL AND ELECTRONICS ENGINEERS