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Device for reflowing electrodeposited solder on terminalsTerminals are reflowed in a hot strata and solidified in a cooler strata, without physical contact with each other, any fixturing, or the container. Terminals are passed through the upper portion of a reflow flask containing hot peanut oil, and then through the lower portion containing oil at ambient temperatures.
Document ID
19690000601
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Johnson, W. C.
Date Acquired
August 5, 2013
Publication Date
December 1, 1969
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-13821
Report Number: MFS-13821
Accession Number
69B10670
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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