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Pulsed high-voltage dc RF sputteringSputtering technique uses pulsed high voltage direct current to the object to be plated and a radio frequency sputtered film source. Resultant film has excellent adhesion, and objects can be plated uniformly on all sides.
Document ID
19690000619
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Przybyszewski, J. S., Jr.
Shaltens, R. K.
Date Acquired
August 5, 2013
Publication Date
December 1, 1969
Subject Category
Electronic Components And Circuits
Report/Patent Number
LEW-10920
Report Number: LEW-10920
Accession Number
69B10699
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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