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Stress relief of copper clad microwave circuit laminates to reduce and prevent warpageStress relief of copper-clad microwave circuit laminates to reduce and prevent warpage
Document ID
19690015636
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Boone, W. L., Jr. (International Business Machines Corp. Huntsville, AL, United States)
Date Acquired
August 5, 2013
Publication Date
May 25, 1967
Subject Category
Electronic Equipment
Report/Patent Number
NASA-CR-100848
Report Number: NASA-CR-100848
Accession Number
69N25014
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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