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On bonding large area silicon wafers Final reportBonding techniques, stress analysis, and bond properties for large-area silicon wafers
Document ID
19690015751
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Date Acquired
August 5, 2013
Publication Date
January 1, 1969
Subject Category
Machine Elements And Processes
Report/Patent Number
NASA-CR-100816
Report Number: NASA-CR-100816
Accession Number
69N25129
Funding Number(s)
CONTRACT_GRANT: NAS7-100
CONTRACT_GRANT: JPL-952022
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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