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A method for separating a semiconductor wafer into individual chipsBreaking of semiconductor single crystal wafer into chips
Document ID
19690029389
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Litant, I. (NASA Electronics Research Center Cambridge, MA, United States)
Date Acquired
September 2, 2013
Publication Date
October 1, 1969
Subject Category
Electronic Equipment
Report/Patent Number
C-85
NASA-TM-X-1892
Report Number: C-85
Report Number: NASA-TM-X-1892
Accession Number
69N38774
Funding Number(s)
CONTRACT_GRANT: 125-25-02-14-25
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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