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Further studies of diffusion bonding below 1000 deg F.Diffusion bonding for leaktight joints in connectors using intermediate metal system of Au-Cu-Au
Document ID
19690052111
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Kammer, P. A.
Martin, D. C.
Monroe, R. E.
Date Acquired
August 5, 2013
Publication Date
March 1, 1969
Subject Category
Machine Elements And Processes
Accession Number
69A30100
Funding Number(s)
CONTRACT_GRANT: NAS8-11523
Distribution Limits
Public
Copyright
Other

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