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Improved beam-lead interconnection structure for uncased integrated circuit chipsInterconnection structure eliminates several levels of manually made interconnections and shortens the path lengths from generator to load, permitting reduction in consumed power.
Document ID
19700000018
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Marley, J. (ITT FEDERAL LABS.)
Date Acquired
August 5, 2013
Publication Date
July 1, 1970
Subject Category
Electronic Components And Circuits
Report/Patent Number
LAR-10227
Report Number: LAR-10227
Accession Number
70B10018
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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