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Holographic stress analysisDevice for nondestructive testing of soldered joints correlates stress with load to predict printed circuit board lifetime.
Document ID
19700000119
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Williams, J. R.
Date Acquired
August 5, 2013
Publication Date
June 1, 1970
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-20687
Report Number: MFS-20687
Accession Number
70B10123
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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