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A new low-expansion nonflammable printed circuit boardPrinted circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.
Document ID
19700000148
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Kennedy, B. W.
Date Acquired
August 5, 2013
Publication Date
May 1, 1970
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-20408
Report Number: MFS-20408
Accession Number
70B10154
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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