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Application of scanning electron microscopy to integrated circuit failureIntegrated circuit failure analysis with scanning electron microscopy taking into account ball bond contamination and open metallization at contact windows
Document ID
19700049250
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Devaney, J. R.
Date Acquired
August 5, 2013
Publication Date
March 1, 1970
Subject Category
Electronic Equipment
Accession Number
70A25366
Distribution Limits
Public
Copyright
Other

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