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Glass bonding techniques for semiconductor strain gagesGlass bonding techniques for semiconductor strain gages, discussing outgassing minimization, hysteresis and repeatability and operational temperature range extension
Document ID
19700056209
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gravel, C.
Leasure, W. A., Jr.
Woodruff, N.
Date Acquired
August 5, 2013
Publication Date
May 1, 1970
Subject Category
Instrumentation And Photography
Meeting Information
Meeting: SOCIETY FOR EXPERIMENTAL STRESS ANALYSIS, SPRING MEETING
Location: HUNTSVILLE, AL
Start Date: May 19, 1970
End Date: May 22, 1970
Sponsors: SOCIETY FOR EXPERIMENTAL STRESS ANALYSIS
Accession Number
70A32325
Funding Number(s)
CONTRACT_GRANT: NAS5-11558
Distribution Limits
Public
Copyright
Other

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