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Metallization systems for integrated circuitsMetallization systems materials for IC, discussing environmental stability, metals electromigration, electrochemical corrosion tests, etc
Document ID
19700068417
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Terry, L. E.
Wilson, R. W.
Date Acquired
August 5, 2013
Publication Date
January 1, 1970
Publication Information
Publisher: INDUSTRIAL AND SCIENTIFIC CONFERENCE MANAGEMENT, INC.,
Subject Category
Electronic Equipment
Meeting Information
Meeting: NATIONAL ELECTRONIC PACKAGING AND PRODUCTION CONFERENCE
Location: ANAHEIM, CA
Start Date: February 10, 1970
End Date: February 12, 1970
Sponsors: NATIONAL ELECTRONIC PACKAGING AND PRODUCTION CONFERENCE
Accession Number
70A44533
Funding Number(s)
CONTRACT_GRANT: NAS12-132
Distribution Limits
Public
Copyright
Other

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