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High density packaging of micrologic flatpacks using high density and low cost techniquesHigh density packaging of micrologic flatpacks using high interconnection method for two-side use of double-sided card in space flight applications
Document ID
19700070132
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
White, R. A.
Date Acquired
August 5, 2013
Publication Date
January 1, 1970
Publication Information
Publisher: INDUSTRIAL AND SCIENTIFIC CONFERENCE MANAGEMENT, INC.,
Subject Category
Electronic Equipment
Meeting Information
Meeting: IN- NATIONAL ELECTRONIC PACKAGING AND PRODUCTION CONFERENCE /CENTRAL/
Location: CHICAGO, IL
Start Date: April 7, 1970
End Date: April 9, 1970
Sponsors: NATIONAL ELECTRONIC PACKAGING
Accession Number
70A46248
Distribution Limits
Public
Copyright
Other

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