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Ceramic wiring board increases packaging density of electronic modulesCeramic multilayer wiring board interconnects large scale integration /LSI/ modules which dissipate nearly 2W/cc. Extremely high packaging density is possible by application of alumina cover hermetically sealed to board. Signal interconnections are completely dependent on transfer heat between layers.
Document ID
19710000083
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Hamley, L. D. (MIT)
Martin, J. H.
Date Acquired
August 6, 2013
Publication Date
April 1, 1971
Subject Category
Electronic Components And Circuits
Report/Patent Number
MSC-13497
Report Number: MSC-13497
Accession Number
71B10084
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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