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Electroplating on titanium alloyActivation process forms adherent electrodeposits of copper, nickel, and chromium on titanium alloy. Good adhesion of electroplated deposits is obtained by using acetic-hydrofluoric acid anodic activation process.
Document ID
19710000336
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Lowery, J. R.
Date Acquired
August 6, 2013
Publication Date
September 1, 1971
Subject Category
Fabrication Technology
Report/Patent Number
MFS-21251
Report Number: MFS-21251
Accession Number
71B10338
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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