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Apparatus and method for separating a semiconductor wafer PatentSeparation of semiconductor wafer into chips bounded by scribe lines
Document ID
19710004879
Acquisition Source
Legacy CDMS
Document Type
Other - Other
Authors
Litant, I. (NASA Electronics Research Center Cambridge, MA, United States)
Scapicchio, A. J. (NASA Electronics Research Center Cambridge, MA, United States)
Date Acquired
August 6, 2013
Publication Date
February 3, 1970
Subject Category
Physics, Solid-State
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-821586
Patent Number: NASA-CASE-ERC-10138
Patent Number: US-PATENT-3,493,155
Accession Number
71N14354
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-ERC-10138|US-PATENT-3,493,155
Patent Application
US-PATENT-APPL-SN-821586

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