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Evaluation of nondestructive tensile testingEvaluation of nondestructive tensile testing of chip and wire bonds in semiconductor devices
Document ID
19710028040
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Polcari, S. M. (Transportation Systems Center Cambridge, MA, United States)
Bowe, J. J. (Transportation Systems Center Cambridge, MA, United States)
Date Acquired
September 2, 2013
Publication Date
June 1, 1971
Subject Category
Structural Mechanics
Report/Patent Number
NASA-CR-122643
DOT-TSC-NASA-71-10
Report Number: DOT-TSC-NASA-71-10
Report Number: NASA-CR-122643
Accession Number
71N37516
Funding Number(s)
CONTRACT_GRANT: NASA ORDER W-13256
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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