Encapsulated adhesive systems and their potential applicationsMicroencapsulation of bonded reactive resins in packaging, logistics and adhesive applications at room and elevated temperatures
Document ID
19710043423
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Davis, T. R.
Hanny, J. F.
Hilbelink, R. D.
Schaab, C. K.
Date Acquired
August 6, 2013
Publication Date
January 1, 1970
Publication Information
Publisher: SOCIETY OF AEROSPACE MATERIAL AND PROCESS ENGINEERS,
Subject Category
Materials, Nonmetallic
Meeting Information
Meeting: AEROSPACE ADHESIVES AND ELASTOMERS NATIONAL TECHNICAL CONFERENCE
Location: DALLAS, TX
Start Date: October 6, 1970
End Date: October 8, 1970
Sponsors: SOCIETY OF AEROSPACE MATERIAL AND PROCESS ENGINEERS