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The feasibility of packaging high-frequency microcircuits inside the magnetic coreHF microcircuits packaging inside magnetic cores, discussing inherent advantages of RF interference and radiation shielding and heat transfer properties
Document ID
19710046736
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Westrom, J. L.
Date Acquired
August 6, 2013
Publication Date
March 1, 1971
Subject Category
Electronic Equipment
Meeting Information
Meeting: POWER CONDITIONING SPECIALISTS CONFERENCE
Location: GREENBELT, MD
Start Date: April 20, 1970
Sponsors: INST. OF ELECTRICAL AND ELECTRONICS ENGINEERS
Accession Number
71A27433
Distribution Limits
Public
Copyright
Other

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