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Packaging concept for LSI beam lead integrated circuitsDevelopment of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.
Document ID
19720000328
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Kennedy, B. W.
Date Acquired
August 6, 2013
Publication Date
July 1, 1972
Subject Category
Machinery
Report/Patent Number
MFS-21374
Report Number: MFS-21374
Accession Number
72B10329
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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