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Review of deformation behavior of tungsten at temperature less than 0.2 absolute melting temperatureThe deformation behavior of tungsten at temperatures 0.2 T sub m is reviewed, with primary emphasis on the temperature dependence of the yield stress and the ductile-brittle transition temperature. It appears that a model based on the high Peierls stress of tungsten best accounts for the observed mechanical behavior at low temperatures. Recent research is discussed which suggests an important role of electron concentration and bonding on the mechanical behavior of tungsten. It is concluded that future research on tungsten should include studies to define more clearly the correlation between electron concentration and mechanical behavior of tungsten alloys and other transition metal alloys.
Document ID
19720006900
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Stephens, J. R.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 2, 2013
Publication Date
January 1, 1972
Subject Category
Materials, Metallic
Report/Patent Number
NASA-TM-X-2482
E-6500
Report Number: NASA-TM-X-2482
Report Number: E-6500
Accession Number
72N14550
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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