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Thermally conductive polymersA thermally conductive polymer is provided having physical and chemical properties suited to use as a medium for potting electrical components. The polymer is prepared from hydroquinone, phenol, and formaldehyde, by conventional procedures employed for the preparation of phenol-formaldehyde resins. While the proportions of the monomers can be varied, a preferred polymer is formed from the monomers in a 1:1:2.4 molar or ratio of hydroquinone:phenol:formaldehyde.
Document ID
19720013455
Acquisition Source
Legacy CDMS
Document Type
Other - Patent Application
Authors
Byrd, N. R.
(McDonnell-Douglas Corp. Saint Louis, MO, United States)
Jenkins, R. K.
(McDonnell-Douglas Corp. Saint Louis, MO, United States)
Lister, J. L.
(McDonnell-Douglas Corp. Saint Louis, MO, United States)
Date Acquired
September 2, 2013
Publication Date
April 27, 1971
Subject Category
Chemistry
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-137912
Patent Number: NASA-CASE-GSC-11304-1
Accession Number
72N21105
Funding Number(s)
CONTRACT_GRANT: NAS5-10260
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-GSC-11304-1
Patent Application
US-PATENT-APPL-SN-137912
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