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Properties of conductive thick-film inksTen different conductive inks used in the fabrication of thick-film circuits were evaluated for their physical and handling properties. Viscosity, solid contents, and spectrographic analysis of the unfired inks were determined. Inks were screened on ceramic substrates and fired for varying times at specified temperatures. Selected substrates were given additional firings to simulate the heat exposure received if thick-film resistors were to be added to the same substrate. Data are presented covering the (1) printing characteristics, (2) solderability using Sn-63 and also a 4 percent silver solder, (3) leach resistance, (4) solder adhesion, and (5) wire bonding properties. Results obtained using different firing schedules were compared. A comparison was made between the various inks showing general results obtained for each ink. The changes in firing time or the application of a simulated resistor firing had little effect on the properties of most inks.
Document ID
19720018038
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Holtze, R. F.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Date Acquired
September 2, 2013
Publication Date
April 15, 1972
Subject Category
Physics, Solid-State
Report/Patent Number
JPL-TM-33-532
NASA-CR-126973
Report Number: JPL-TM-33-532
Report Number: NASA-CR-126973
Accession Number
72N25688
Funding Number(s)
CONTRACT_GRANT: NAS7-100
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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