Generation of long time creep data on refractory alloys at elevated temperatures

Ultrahigh vacuum creep tests were performed on tungsten, molybdenum, and tantalum alloys to develop design creep data and to evaluate the influence of liquid lithium exposure on the creep resistance of a tantalum alloy. Test conditions were generally selected to provide 1% creep in 1000 to 10,000 hours, with the test temperatures ranging between 1600 and 2900 F (1144 K and 1866 K). One percent creep life data from a tantalum-base T-111 alloy (Ta-8%W-2%Hf) were analyzed using a station function method to provide an improved parametric representation of the T-111 data. In addition, the minimum creep rate data from an ASTAR 811C alloy (Ta-8%W-1%Re-0.7%Hf0.025%C) were analyzed to determine the stress and temperature dependence of creep rate. Results of this analysis indicated that the activation energy for creep decreased from about 150 Kcal/mole (5130 J/mole) above 2400 F (1589 K) to about 110 Kcal/mole (3760 J/mole) below 2000 F (1361 K). This temperature range corresponds to the range where the creep mechanism changes from grain boundary sliding to intragranular creep.