Design and development of pressure and repressurization purge system for reusable space shuttle multilayer insulation system

The experimental determination of purge bag materials properties, development of purge bag manufacturing techniques, experimental evaluation of a subscale purge bag under simulated operating conditions and the experimental evaluation of the purge pin concept for MLI purging are discussed. The basic purge bag material, epoxy fiberglass bounded by skins of FEP Teflon, showed no significant permeability to helium flow under normal operating conditions. Purge bag small scale manufacturing tests were conducted to develop tooling and fabrication techniques for use in full scale bag manufacture. A purge bag material layup technique was developed whereby the two plys of epoxy fiberglass enclosed between skins of FEP Teflon are vacuum bag cured in an oven in a single operation. The material is cured on a tool with the shape of a purge bag half. Plastic tooling was selected for use in bag fabrication. A model purge bag 0.6 m in diameter was fabricated and subjected to a series of structural and environmental tests simulating various flight type environments. Pressure cycling tests at high (450 K) and low (200 K) temperature as well as acoustic loading tests were performed. The purge bag concept proved to be structurally sound and was used for the full scale bag detailed design model.