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Method and apparatus for sputtering utilizing an apertured electrode and a pulsed substrate biasThe method and equipment used for sputtering by use of an apertured electrode and a pulsed substrate bias are discussed. The technique combines the advantages of ion plating with the versatility of a radio frequency sputtered source. Electroplating is accomplished by passing a pulsed high voltage direct current to the article being plated during radio frequency sputtering.
Document ID
19730015842
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Przybyszewski, J. S. (NASA Lewis Research Center Cleveland, OH, United States)
Shaltens, R. K. (NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
September 2, 2013
Publication Date
May 8, 1973
Subject Category
Materials, Metallic
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-106424
Patent Number: US-PATENT-3,732,158
Patent Number: NASA-CASE-LEW-10920-1
Accession Number
73N24569
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-3,732,158|NASA-CASE-LEW-10920-1
Patent Application
US-PATENT-APPL-SN-106424

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