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Circuit board package with wedge shaped coversA circuit board packaging and mounting technique that protects the wiring board from vibrations and contamination is described. The technique also augments chassis rigidity and damping and conducts component generated heat to the chassis.
Document ID
19730016516
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Pesek, C. T. (North American Rockwell Corp. Canoga Park, CA, United States)
Date Acquired
August 7, 2013
Publication Date
May 22, 1973
Subject Category
Electronics
Report/Patent Number
Patent Number: US-PATENT-3,735,206
Patent Number: NASA-CASE-MFS-21919-1
Patent Application Number: US-PATENT-APPL-SN-193456
Accession Number
73N25243
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-3,735,206|NASA-CASE-MFS-21919-1
Patent Application
US-PATENT-APPL-SN-193456

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