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Development and evaluation of polyimide laminates for printed wiring board applicationsA developmental and evaluation program on polyimide laminates as printed wiring boards is described. The development of an experimental polyimide with low linear coefficient of thermal expansion normal to the plane of the board is discussed, and its properties are evaluated along with two commercial polyimide printed wiring boards for comparison with the type G-10 epoxy board. Thermal cycling data indicate an urgent need for effectively controlling the expansion normal to the plane of the board in order to minimize solder joint damage.
Document ID
19730017854
Acquisition Source
Legacy CDMS
Document Type
Technical Memorandum (TM)
Authors
Patterson, W. J. (NASA Marshall Space Flight Center Huntsville, AL, United States)
Date Acquired
August 7, 2013
Publication Date
June 12, 1973
Subject Category
Materials, Nonmetallic
Report/Patent Number
NASA-TM-X-64760
Report Number: NASA-TM-X-64760
Accession Number
73N26581
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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