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Heat Pipe Thermal Conditioning PanelThe development, fabrication, and evaluation of heat pipe thermal conditioning panels are discussed. The panels were designed and fabricated to be compatible with several planned NASA space vehicles, in terms of panel size, capacity, temperature gradients, and integration with various heat exchangers and electronic components. It was satisfactorily demonstrated that the heat pipe thermal conditioning panel meets the thermal efficiency and heat transport requirements.
Document ID
19730025166
Acquisition Source
Legacy CDMS
Document Type
Contractor Report (CR)
Authors
Saaski, E. W.
(McDonnell-Douglas Astronautics Co. Richland, WA, United States)
Date Acquired
September 2, 2013
Publication Date
September 1, 1973
Subject Category
Thermodynamics And Combustion
Report/Patent Number
NASA-CR-124453
MDC-G4422
Report Number: NASA-CR-124453
Report Number: MDC-G4422
Accession Number
73N33899
Funding Number(s)
CONTRACT_GRANT: NAS8-28639
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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