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Method for compression molding of thermosetting plastics utilizing a temperature gradient across the plastic to cure the articleA method is described for compression molding of thermosetting plastics composition. Heat is applied to the compressed load in a mold cavity and adjusted to hold molding temperature at the interface of the cavity surface and the compressed compound to produce a thermal front. This thermal front advances into the evacuated compound at mean right angles to the compression load and toward a thermal fence formed at the opposite surface of the compressed compound.
Document ID
19740010011
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Heier, W. C.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 3, 2013
Publication Date
February 5, 1974
Subject Category
Space Vehicles
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-198763
Patent Number: NASA-CASE-LAR-10489-1
Patent Number: US-PATENT-3,790,650
Accession Number
74N18124
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-10489-1|US-PATENT-3,790,650
Patent Application
US-PATENT-APPL-SN-198763
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