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Bonded joint and methodAn improved joint is described for reducing the peak shear stress in adhesive bonds when adhesives are used to bond two materials which are in a lapped relationship and which differ in value of modulus of elasticity. An insert placed between the adhesive and one of the two materials acts to cushion the discontinuity of material stiffness thereby reducing the peak shear stress in the adhesive bond.
Document ID
19740014951
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Sainsbury-Carter, J. B. (United Aircraft Corp. Stratford Conn., United States)
Date Acquired
September 3, 2013
Publication Date
May 7, 1974
Subject Category
General
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-290021
Patent Number: US-PATENT-3,809,601
Patent Number: NASA-CASE-LAR-10900-1
Accession Number
74N23064
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-3,809,601|NASA-CASE-LAR-10900-1
Patent Application
US-PATENT-APPL-SN-290021

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