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Improved printed-wiring boards for high-reliability circuitsExperimental board includes three layers of special tridirectionally woven fabric. Alumina particles play major role in reducing coefficient of expansion. They also serve as heat sink for heat-generating components.
Document ID
19750000039
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Patterson, W. J.
Date Acquired
August 8, 2013
Publication Date
April 1, 1975
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-23147
Report Number: MFS-23147
Accession Number
75B10039
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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