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Shock and vibration isolation mount for small electronic componentsMount includes metallic cup and support ring placed in mold fixture. Viscoelastic material is injected between these parts by means of large hypodermic needle. Circular projections on cup and ring extend into material and are kept in place without dependence on quality of adhesion between material and metal.
Document ID
19750000049
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Dillon, R. F. (Martin Marietta Corp.)
Mayne, R. C.
Date Acquired
August 8, 2013
Publication Date
April 1, 1975
Subject Category
Electronic Components And Circuits
Report/Patent Number
NPO-13253
Report Number: NPO-13253
Accession Number
75B10049
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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