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Open coil structure for bubble-memory-device packagingConcept has several important advantages over close-wound system: memory and coil chips are separate and interchangeable; interconnections in coil level are eliminated by packing memory chip and electronics in single structure; and coil size can be adjusted to optimum value in terms of power dissipation and field uniformity.
Document ID
19750000219
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Chen, T. T. (Rockwell Intern. Corp.)
Ypma, J. E. (Rockwell Intern. Corp.)
Date Acquired
August 8, 2013
Publication Date
October 1, 1975
Subject Category
Electronic Components And Circuits
Report/Patent Number
Report Number: LAR-11704
LAR-11704
Accession Number
75B10219
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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