NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
Quality control of microelectronic wire bondsReport evaluates ultrasonic bonding of small-diameter aluminum wire joined to ceramic substrates metalized with thin-film and thick-film gold. Quick testing technique for nondestructive location of poor wire bonds is also presented.
Document ID
19750000312
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Thiel, R. A. (Gen. Dyn. Corp.)
Schmidt, G. D. (Gen. Dyn. Corp.)
Date Acquired
August 8, 2013
Publication Date
December 1, 1975
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-23327
Report Number: MFS-23327
Accession Number
75B10312
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

Related Records

There are no records associated with this record.
No Preview Available