Effect of thermal profile on cyclic flaw growth in aluminum

Surface flawed and single edge notch tension specimens of 2219-T851 and -T87 aluminum were tested to determine static fracture characteristics and base line (constant amplitude, constant temperature) cyclic flaw growth behavior. Subsequent testing was then conducted in which flawed specimens were subjected to a thermal profile in which the applied stress was varied simultaneously with the temperature. The profile used represents a simplified space shuttle orbiter load/temperature flight cycle. Test temperatures included the range from 144K (-200 F) up to 450K (350 F). The measured flaw growth rates obtained from the thermal profile tests were then compared with rates predicted by assuming linear cumulative damage of base line rates.