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Multitarget sequential sputtering apparatusThe development and characteristics of a sputtering apparatus are discussed. A potential difference is applied between the cathode and anode to produce a plasma for each target which is sputtered by accelerated ions within the plasma. The process of sputtering for various materials is described. Diagrams of the unit are provided.
Document ID
19750011612
Acquisition Source
Legacy CDMS
Document Type
Other - Patent
Authors
Shima, R. (JPL)
Date Acquired
September 3, 2013
Publication Date
February 4, 1975
Subject Category
Mechanical Engineering
Report/Patent Number
Patent Application Number: US-PATENT-APPL-SN-462705
Patent Number: US-PATENT-3,864,239
Patent Number: NASA-CASE-NPO-13345-1
Accession Number
75N19684
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-PATENT-3,864,239|NASA-CASE-NPO-13345-1
Patent Application
US-PATENT-APPL-SN-462705

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