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Polyimide adhesivesA process of preparing aromatic polyamide-acids for use as adhesives is described. An equimolar quantity of an aromatic dianhydride is added to a stirred solution of an aromatic diamine in a water or alcohol-miscible ether solvent to obtain a viscous polymer solution. The polymeric-acid intermediate polymer does not become insoluble but directly forms a smooth viscous polymer solution. These polyamic-acid polymers are converted, by heating in the range of 200-300 C and with pressure, to form polyimides with excellent adhesive properties.
Document ID
19750021190
Acquisition Source
Legacy CDMS
Document Type
Other - Patent Application
Authors
Progar, D. J. (NASA Langley Research Center Hampton, VA, United States)
Bell, V. L. (NASA Langley Research Center Hampton, VA, United States)
Saintclair, T. L. (NASA Langley Research Center Hampton, VA, United States)
Date Acquired
September 3, 2013
Publication Date
December 16, 1974
Subject Category
Nonmetallic Materials
Report/Patent Number
Patent Number: NASA-CASE-LAR-11397-1
Patent Application Number: US-PATENT-APPL-SN-532784
Accession Number
75N29263
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
NASA-CASE-LAR-11397-1
Patent Application
US-PATENT-APPL-SN-532784

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