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Studies on the Al2O3-Ti-Mo-Au metallization systemThe behavior of Ti-Mo-Au metallization on Al2O3 and C has been investigated by backscattering spectrometry. Results show that Mo-Au bimetal films typically mix during deposition. Diffusion of Ti in Mo film occurs at 600 C, but is inhibited by the presence of oxygen in the Ti film. Even 1000 A of Mo is not a barrier against interdiffusion of Ti and Au during 20-min anneals at 600 C. The amount of mixing observed also depends on the nature of the substrate which supports the Ti-Mo-Au metallization.
Document ID
19750041613
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Harris, J. M.
Lugujjo, E.
Nicolet, M.-A. (California Institute of Technology Pasadena, Calif., United States)
Campisano, S. U. (California Institute of Technology, Pasadena, Calif.; Catania, Universita Catania, Italy)
Shima, R. (California Institute of Technology, Jet Propulsion Laboratory, Pasadena Calif., United States)
Date Acquired
August 8, 2013
Publication Date
February 1, 1975
Subject Category
Metallic Materials
Accession Number
75A25685
Distribution Limits
Public
Copyright
Other

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