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Reliability of hybrid microcircuit bondingMicrocircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques.
Document ID
19760000129
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Caruso, S. V.
Kinser, D. L.
Graff, S. M.
Allen, R. V.
Date Acquired
August 8, 2013
Publication Date
March 1, 1976
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 1
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
MFS-23358
ISSN: 0145-319X
Report Number: MFS-23358
Accession Number
76B10129
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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