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Transistor-to-substrate bond qualityQuantitative measurement of X-ray images of bonded power-transistor chips is accomplished by using light meter, which determines percentage of voids in bond.
Document ID
19760000137
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Telfer, T. A. (GE)
Date Acquired
August 8, 2013
Publication Date
August 1, 1976
Publication Information
Publication: NASA Tech Briefs
Volume: 1
Issue: 2
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
MFS-21931
Report Number: MFS-21931
ISSN: 0145-319X
Accession Number
76B10137
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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